Moisture Sensitivity of Plastic Packages of IC Devices

This book provides information on the state-of-the-art technologies and methodologies related to moisture issues in plastic packages. The book covers the wide aspects including moisture diffusion and desorption, characterization and modeling, hygroscopic swelling, interfacial adhesion degradation, accelerated moisture sensitivity/reflow test, electrical-chemical migration, moisture-aging effect on longterm reliability, and several finely selected real-world case studies on various failure mechanisms due to moisture. This is the first book ever to cover the full spectrum of moisture-induced failure mechanisms in IC packages. It is a timely and important contribution to the technical literature for researchers, engineers, and practitioners both in academia and in electronics industry.

The editors of the book, Dr. Fan and Dr. Suhir, have rich experience in both theoretical development and industrial practice. They have been offering the professional development courses at various IEEE (Institute of Electrical and Electronics Engineers) CPMT (components packaging and manufacturing technologies) Society conferences, and hundreds of participants have attended their lectures. They have succeeded in bringing together well-recognized experts in this field and present a fine collection of papers covering the full spectrum of the related topics. They are to be congratulated for bringing this very important topic forth in a timely manner.