Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Thisbook provides an overview of the circuits, architectures, and chippackaging for coupled data techniques. It discusses the currentresearch in chip-to-board capacitive coupling, chip-to-chipcapacitive coupling, chip-to-chip inductive coupling, andchip-to-chip optical coupling. Circuits, modeling, and theirimplications for packaging are explored in depth. Mechanical methodsto ensure accurate and sustained chip alignment are discussed, aswell as electrical methods to compensate for resulting misalignment.Finally, the book covers issues raised by design for manufacturingand test.

Thisbook is one of the first in a new and emerging area. Coupled datacommunication offers new ways of looking at the old problem oflimited off-chip I/O: it trades off packaging complexity for I/Operformance; it offers a set of enabling technologies for 3D orstacked-chip architectures; and it raises the possibility ofreplace-able chips--and thus high yield--in an MCM.